To be fair to the raw capabilities of the semiconductor industry, a 100mm^2 die at 3nm can contain on the order of 1~10 trillion features. I don't know that we are actually that far off in terms of scale. How to arrange these features seems to be the difficult part.
The EDA [0] problem is immune to the bitter lesson. There are certainly specific arrangements of matter that can solve this problem better than a GPU/TPU/CPU can today.
The bigger issue though is that we can't scale that die to the approximate volume of a human brain in any dimension.
Those feature sizes are tiny, yes, but we struggle to put them in a block the size of a human brain and keep it cool enough to be useful (or even make it affordable).
The EDA [0] problem is immune to the bitter lesson. There are certainly specific arrangements of matter that can solve this problem better than a GPU/TPU/CPU can today.
[0] https://en.wikipedia.org/wiki/Electronic_design_automation