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Even if this is not cutting egde, it will sell and more so with all those small ASIC chips upon their top node, will help fill out the wafers to allow the unused jaggy edges to be filled with these smaller dies in production.

Now, even without that possibility, Intel is ramping up its fabrication and offerings and if they can maintain that momentum outside their core buisness as they seem to be going, then the more products they can keep the fabs busy and turn some profit is good. Even if they broke even upon this, they would still have this and other avenues to pad out production runs and their lab running costs.

Depending upon how this goes, may see this fused into some GPU offering down the line for that market, certainly they have the ability to do that if the demand is there and also help open up there GPU plans more.

So on the face of it, sure it's another option for crypo miners, but deeper, it too me seems like Intel leveridging some low hanging fruit to give there fab offerings more momentum and shifting towards competing with the TSMC's being an end goal perhaps, certainly lots of catchup. Though the aspect of production wafers and having lots of smaller chips you can pad out a wafer, sure does seem like a capital move and be interesting if they go down that path. For me, it seems like mixed wafer production using smaller dies to flesh out the unused space left by larger dies upon a round wafer as a great way to reduce waste and turn that into profit.




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